[Acpc-l] Updates on World's Leading B3G/4G R&D and Design Summits
tpc@4gforum.com
tpc@4gforum.com
Wed, 11 Feb 2004 18:11:37 -0800 (PST)
------=_20040211181137_84380
Content-Type: text/plain; charset="iso-8859-1"
Content-Transfer-Encoding: 8bit
==========================================================
2004 IEEE/CIC GLOBAL MOBILE CONGRESS, SHANGHAI
(Official Launch of Fourth Generation Mobile Forum(4GMF)(R))
www.mobile2004.com OR www.4gforum.com
==========================================================
[UPDATES]
Officially endorsed by China Ministry of Information Industry,
Sponsored by IEEE China and China Institute of Communications,
Co-organized by Shanghai Research Center of Wireless Comm.,
Global R&D and Design Summit on B3G and 4G mobile technologies,
Cutoff Date of Call-for-Papers: March 30, 2004,
Deadline of Sponsorship & Exhibition: April 30, 2004,
Information of Executive Committees are available in web,
Over 1000 R&D and Design professionals will be joining this GMC'04,
Wonderful and fantastic social events and business visits included.
For more information, visit: http://www.mobile2004.com
=================================================
5TH WORLD WIRELESS CONGRESS, SAN FRANCISCO
(World's Leading Summit on B3G/4G R&D, EI Indexed)
www.b3g.org OR www.wirelesscongress.com
=================================================
[UPDATES]
Officially approved by International Engineering Information (EI) Index,
World's Summit on B3G System Architectures & Product Definitions,
WWC proceedings shipped over 4,000 copies as major B3G design book,
Congress website visited by over 1,000,000 professionals as of 2/2/04,
Sponsored by major leading wireless industries,
Keynote Speeches by World-class leading Executives and Experts,
Technical program is the most authoritative on B3G/4G R&D worldwide,
Congress registration and hotel reservation website are open now,
Cutoff date of early registration discount: April 15, 2004,
To be a sponsor or exhibitor of this leading event please check web.
For more information, visit: http://www.b3g.org
======================================================
For more details, please click the attached HTML message
======================================================
------=_20040211181137_84380
Content-Type: message/rfc822; name="Updates on World's
Leading B3G/4G R&D and Design
Summits.eml"
Content-Transfer-Encoding: 8bit
Content-Disposition: attachment; filename="Updates on
World's Leading B3G/4G R&D and
Design Summits.eml"
Return-Path: <tpc@4gforum.com>
Received: from smtp810.mail.sc5.yahoo.com (smtp810.mail.sc5.yahoo.com [66.163.170.80])
by pro4.abac.com (8.12.10/8.12.10) with SMTP id i1B4hGn9067668
for <tpc@4gforum.com>; Tue, 10 Feb 2004 20:43:17 -0800 (PST)
(envelope-from tpc@4gforum.com)
Received: from unknown (HELO 4gforum.com) (sieneon@sbcglobal.net@218.80.41.205 with plain)
by smtp810.mail.sc5.yahoo.com with SMTP; 11 Feb 2004 04:43:15 -0000
Message-ID: <40270DDD.6205E61A@4gforum.com>
Date: Mon, 09 Feb 2004 12:34:38 +0800
From: Organizing Committee <tpc@4gforum.com>
Organization: WWC'04/GMC'04
X-Mailer: Mozilla 4.79 [en] (Windows NT 5.0; U)
X-Accept-Language: en
MIME-Version: 1.0
To: tpc@4gforum.com
Subject: Updates on World's Leading B3G/4G R&D and Design Summits
X-Priority: 1 (Highest)
References: <4026FB1C.CBA6BD63@ieee.org>
Content-Type: text/html; charset=us-ascii
Content-Transfer-Encoding: 7bit
X-Spam-Score: 3.786 (CLICK_BELOW_CAPS,HTML_20_30,HTML_LINK_CLICK_CAPS,HTML_LINK_CLICK_HERE,HTML_MESSAGE,MIME_HTML_ONLY,X_PRIORITY_HIGH)
X-Spam-Level: !!!
X-Scanned-By: MIMEDefang 2.39
<!doctype html public "-//w3c//dtd html 4.0 transitional//en">
<html>
<blockquote TYPE=CITE>================================================
<br>2004 IEEE/CIC GLOBAL MOBILE CONGRESS, SHANGHAI
<br>(Official Launch of Fourth Generation Mobile Forum (4GMF)(R))
<br>www.mobile2004.com OR www.4gforum.com
<br>================================================
<p>[UPDATES]
<br>Officially endorsed by China Ministry of Information Industry
<br>Sponsored by IEEE China and China Institute of Communications
<br>Co-organized by Shanghai Research Center of Wireless Comm.
<br>Global R&D and Design Summit on B3G and 4G mobile technologies
<br>Cutoff Date of Call-for-Papers: March 30, 2004. <a href="http://b3g.org/gmc/call.htm">More
Info Here</a>
<br>Deadline of Sponsorship & Exhibition: April 30, 2004. <a href="http://b3g.org/gmc/spons.htm">More
Info Here</a>
<br>Information of <a href="http://b3g.org/gmc/sc.htm">Executive Committees
are available here</a>
<br>For newest information on this historic mobile summit, <a href="http://b3g.org/gmc/wnews.htm">please
click here</a>
<br>Over 1000 R&D and Design professionals will be joining this GMC'04
<br>Wonderful and fantastic social events and business visits included
<br>
<p>==============================================
<br>5TH WORLD WIRELESS CONGRESS, SAN FRANCISCO
<br>(World's Leading Summit on B3G/4G R&D, EI Indexed)
<br>www.b3g.org OR www.wirelesscongress.com
<br>==============================================
<p>[UPDATES]
<br>Officially approved by International Engineering Information (EI) Index
<br>World's Summit on B3G System Architectures & Product Definitions
<br>WWC proceedings shipped over 4,000 copies as major B3G design book
<br>Congress website visited by over 1,000,000 professionals as of 2/2/04
<br>Sponsored by major leading wireless industries. <a href="http://b3g.org/leader.htm">More
Info Here</a>
<br>Keynote Speeches by <a href="http://b3g.org/featured.htm">World-class
leading Executives and Experts</a>
<br><a href="http://b3g.org/paper.htm">Technical program</a> is the most
authoritative on B3G/4G R&D worldwide
<br><a href="http://b3g.org/regist.htm">Congress registration</a> and <a href="http://b3g.org/venue.htm">hotel
reservation</a> website are open now
<br>Cutoff date of early registration discount: April 15, 2004. <a href="http://b3g.org/regist.htm">More
Info Here</a>
<br>To be a sponsor or exhibitor of this world's leading event, <a href="http://b3g.org/spons.htm">CLICK
HERE</a>
<br>For newest information on this global wireless summit, <a href="http://b3g.org/wnew.htm">please
click here</a>
<br>
<br>
<br>
<p>[To unsubscribe from this Wireless R&D list, please <a href="mailto:tpc@4gforum.com">e-mail
here</a>]</blockquote>
</html>
------=_20040211181137_84380--